Hardware development · Service 01

Electronics development and PCB design in Switzerland

As a service provider for electronics development, Fermium takes on circuit design and PCB layout through to manufacturing handover: multi-layer and HDI boards, high-speed interfaces and EMC-compliant layouts for new products, cost-reduction projects and redesigns after component obsolescence.

Or call us: +41 78 914 41 45

What we do

PCB layout from schematic to manufacturing data

We design each board for its production process. We agree the stack-up, critical components and test points with PCB manufacturers and assembly partners before layout starts.

01

Multi-layer and HDI boards

Boards with 20 or more layers, HDI stack-ups with microvias and via-in-pad, and controlled-impedance layouts. We confirm the stack-up with the PCB manufacturer before layout starts.

02

High-speed PCB design

PCIe, USB 3.x and DDR3 to DDR5 memory interfaces with controlled impedance, length matching and signal integrity checks where needed.

03

MCU, SoC and FPGA boards

Processor boards using STM32, TI, NXP and Microchip microcontrollers, AMD Zynq and Intel SoC FPGAs. Design covers power sequencing, clocking, memory and external interfaces for the target hardware.

04

Flex, rigid-flex and special substrates

Flex and rigid-flex boards for compact assemblies, Rogers laminates for RF sections and metal-core boards for LED and power electronics.

05

EMC-compliant design

Layout, filtering and shielding planned for CE and FCC from the schematic, with pre-compliance measurements before the certification lab.

06

Design for manufacturing and cost reduction

DFM review, component standardisation, second sources and cost-reduction redesigns, coordinated with PCB manufacturers and assembly partners before manufacturing data is released.

Technologies

Platforms and interfaces for hardware development

Microcontrollers

  • STM32 Cortex-M0 to M7
  • TI MSP430
  • TI C2000
  • NXP LPC / Kinetis / i.MX RT
  • Microchip PIC / AVR / SAM

SoC and FPGA hardware

  • AMD Zynq-7000
  • AMD UltraScale+ MPSoC
  • Intel Cyclone V
  • Intel Arria / Stratix 10
  • Efinix

High-speed interfaces

  • PCIe
  • USB 3.x
  • DDR3 / DDR4 / DDR5
  • MIPI CSI-2
  • LVDS / SerDes

Process

From requirements to manufacturing data

We align electrical requirements and production constraints before layout starts.

  1. 01

    Requirements

    Interfaces, power budget, environmental conditions, standards, cost target and quantities written down and agreed.

  2. 02

    Architecture

    Block diagram, component selection with second sources, stack-up and power concept, software interfaces, EMC and mechanical constraints.

  3. 03

    Schematic and PCB layout

    Schematic, controlled-impedance layout, DFM review with the PCB manufacturer and release of the prototype data.

  4. 04

    Bring-up and verification

    Board bring-up, power and signal integrity measurements, EMC pre-compliance and functional tests against the requirements.

  5. 05

    Manufacturing handover

    Manufacturing data, assembly drawings and a BOM with approved alternatives, plus test points documented for series production.

Next step

A personal contact for your project

Describe the device, its current stage and the main requirements. You can attach a specification or a schematic as a PDF. On request, you receive a non-disclosure agreement (NDA) first.

Common questions

Questions about hardware development

Do you design high-speed boards with PCIe, USB 3.x and DDR memory?

Yes. We design controlled-impedance stack-ups, length-matched differential pairs, DDR3 to DDR5 memory interfaces, PCIe and USB 3.x. We check signal integrity during prototype verification.

How do you handle EMC compliance for CE and FCC?

EMC is considered in the schematic and layout, including filtering, grounding, shielding and placement of critical components. We run pre-compliance measurements on prototype boards and address findings before certification testing.

Can you redesign an existing board when a component becomes obsolete?

Yes. Drop-in replacement selection, redesign for current components, cost reduction through component consolidation and alternative sourcing, and long-term availability planning. External interfaces and form factor stay unchanged where the product requires it.

What do we receive at the end of a hardware project?

Schematics, layout data, manufacturing data, the bill of materials with approved alternatives, test reports and documentation. The design files belong to you at handover; Fermium keeps no rights to the product-specific design.

Contact

Discuss your embedded project

Describe the device, its current stage and the main requirements.

What do you need?

Patrick Walther

Founder

Fermium GmbH
Hardeggweg 3
3326 Krauchthal, Switzerland
Fermium GmbH, Hardeggweg 3, 3326 Krauchthal, Switzerland